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TDA7266SAN Datasheet(PDF) 12 Page - STMicroelectronics |
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TDA7266SAN Datasheet(HTML) 12 Page - STMicroelectronics |
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12 / 15 page ![]() Package mechanical data TDA7266SAN 12/15 Doc ID 023621 Rev 1 8 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Clipwatt assembly suggestions The recommended mounting method of the Clipwatt on an external heatsink requires the use of a clip placed as close as possible to the center of the plastic body, as indicated in the example of Figure 15. A thermal grease can be used in order to reduce the additional thermal resistance of the contact between the package and heatsink. A force of 7 - 10 kg gives a good contact and the clip must be designed in order to withstand a maximum contact pressure of 15 kg/mm2 between itself and the plastic body case. For example, if a 15 kg force is applied by the clip on the package, the clip must have a contact area of at least 1 mm2. Figure 15. Example of right placement of the clip |
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