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ST7580 Datasheet(PDF) 30 Page - STMicroelectronics |
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ST7580 Datasheet(HTML) 30 Page - STMicroelectronics |
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30 / 33 page ![]() Package mechanical data ST7580 30/33 Doc ID 022644 Rev 1 11 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. The ST7580 is hosted in a 48-pin thermally enhanced, very thin, fine pitch quad flat package no lead (VFQFPN) with exposed pad, which allows the device to dissipate the heat that is generated by the operation of the two linear regulators and the power amplifier. Table 13. VFQFPN48 (7 x 7 x 1.0 mm) package mechanical data Dim. (mm) Min. Typ. Max. A 0.80 0.90 1.00 A1 0.02 0.05 A2 0.65 1.00 A3 0.25 b 0.18 0.23 0.30 D 6.85 7.00 7.15 D2 4.95 5.10 5.25 E 6.85 7.00 7.15 E2 4.95 5.10 5.25 e 0.45 0.50 0.55 L 0.30 0.40 0.50 ddd 0.08 |
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