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STPS30150C Datasheet(PDF) 5 Page - STMicroelectronics |
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STPS30150C Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 11 page ![]() STPS30150C Characteristics Doc ID 7757 Rev 8 5/11 Figure 11. Forward voltage drop versus forward current (maximum values, per diode) Figure 12. Thermal resistance junction to ambient versus copper surface under tab for D2PAK 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 I (A) FM V (V) FM T =25°C (maximum values) j T =125°C (maximum values) j T =125°C (typical values) j 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 S(Cu)(cm²) R (°C/W) th(j-a) Epoxy printed circuit board FR4, copper thickness: 35µm |
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