EMIF03-SIM02F3

Ordering information

Doc ID 11554 Rev 5

7/9

Figure 18.

Flip Chip tape and reel specification

5

Ordering information

Table 3.

Ordering information

Note:

More information is available in the application notes:

AN2348: “STMicroelectronics 400 micro-metre Flip Chip: package description and

recommendation for use”

AN1751: "EMI filters: recommendations and measurements"

Figure 16.

Footprint

Figure 17.

Marking

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening :

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot, ST logo

ECOPACK status

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4.0 ± 0.1

4.0 ± 0.1

2.0 ± 0.05

Ø 1.55 ± 0.1

0.69 ± 0.05

1.24

0.20 ± 0.02

Order code

Marking

Package

Weight

Base qty

Delivery mode

EMIF03-SIM02F3

HA

Flip Chip

1.74 mg

5000

Tape and reel 7”