EMIF08-LCD04M16

Package information

Doc ID 15673 Rev 2

5/10

3

Package information

●

Epoxy meets UL94, V0

●

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Note:

Product marking may be rotated by 90° for assembly plant differentiation. In no case should

this product marking be used to orient the component for its placement on a PCB. Only pin

1 mark is to be used for this purpose.

Table 3.

Micro QFN 3.3x1.35 16L dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

0.45

0.50

0.55

0.018

0.020

0.022

A1

0.00

0.02

0.05

0.00

0.0008 0.002

b

0.15

0.20

0.25

0.006

0.008

0.010

D

-

3.30

-

-

0.13

-

D2

2.65

2.80

2.90

0.104

0.110

0.114

E

-

1.35

-

-

0.053

-

E2

0.25

0.40

0.50

0.010

0.016

0.020

e

-

0.40

-

-

0.016

-

k

0.20

-

-

0.008

-

-

L

0.15

0.25

0.35

0.006

0.010

0.014

Figure 9.

Footprint

Figure 10.

Marking

D

INDEX AREA

(D/2 x E/2)

TOP VIEW

SIDE VIEW

BOTTOM VIEW

E

A

e

D2

L

b

K

E2

A1

INDEX AREA

(D/2 x E/2)

EXPOSED PAD

PIN # 1 ID

1

8

9

16

0.40

0.45

0.40

0.20

2.80

3.00

0.85 1.75

XX

WW

Y P

Dot: Pin 1

XX: Marking

WW: Assembly week

Y: Assembly year

P: Assembly plant