Package mechanical data

STEVAL-TDR006V1

14/18

Doc ID 15623 Rev 1

6.2

Thermal pad and via design SOT-89

Thermal vias are required in the PCB layout to effectively conduct heat away from the

package. The via pattern has been designed to address thermal, power dissipation and

electrical requirements of the device.

The via pattern is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on

a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in a

design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar

results.

Figure 13.

Pad layout details