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CXP85452 Datasheet(PDF) 21 Page - Sony Corporation |
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CXP85452 Datasheet(HTML) 21 Page - Sony Corporation |
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21 / 21 page ![]() – 21 – CXP85452/85460 Package Outline Unit: mm PACKAGE STRUCTURE MOLDING COMPOUND LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT SONY CODE EIAJ CODE JEDEC CODE SDIP-64P-01 42 ALLOY SOLDER PLATING EPOXY / PHENOL RESIN 64PIN SDIP (PLASTIC) 750mil SDIP064-P-0750-A 57.6 – 0.1 + 0.4 64 33 1 32 1.778 0° to 15° 0.5 ± 0.1 0.9 ± 0.15 8.6g SONY CODE EIAJ CODE JEDEC CODE 23.9 ± 0.4 20.0 – 0.1 1.0 0.4 – 0.1 + 0.15 1 19 20 32 33 51 52 64 0.15 – 0.05 + 0.1 2.75 – 0.15 0.1 – 0.05 + 0.2 M ± 0.12 0.15 + 0.4 + 0.35 64PIN QFP(PLASTIC) QFP–64P–L01 ∗QFP064–P–1420 PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER/PALLADIUM COPPER /42 ALLOY PACKAGE STRUCTURE PLATING 1.5g |
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