DA6240C.000

1 November, 2010

5 (11)

PIN DESCRIPTION

Pin Description

Symbol

Type

X-coordinate

Y-coordinate

Control signal input for setting charge pump mode

EN1

DI

121

695

Control signal input for setting charge pump mode

EN2

DI

121

527

Enable signal + Digital signal input

DIN

DI

121

360

Flying capacitor negative terminal

CN1

I/O

403

121

Supply ground

GND

G

574

121

Digital audio signal output

VO2

DO

765

201

Digital audio signal output

VO1

DO

929

407

Flying capacitor negative terminal

CN2

I/O

929

529

Flying capacitor positive terminal

CP1

I/O

929

682

Charge pump output

VOUT

AO

684

849

Flying capacitor positive terminal

CP2

I/O

570

849

Power supply

VIN

P

393

929

Control signal for current limitation

C1 current limitation ON: XCURL=floating or GND

C2 current limitation OFF: XCURL=VIN

XCURL

DI

285

929

G = Ground, P = Power, D = Digital, A = Analog, I = Input, O = Output.

Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or

left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component

assembly are recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

IC OUTLINES

EN1

EN2

DIN

CP1

CN2

VO1

VO2

ID: MAS6240D1

1130 µ

µ

µ

µ

m

DIE size = 1130 x 1050 mm; PAD size = 80 x 80 µm