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AT45DB321D Datasheet(PDF) 43 Page - Analog Devices

Part # AT45DB321D
Description  32Mb, 2.5V or 2.7V DataFlash
PDF  51 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AT45DB321D Datasheet(HTML) 43 Page - Analog Devices

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AT45DB321D [DATASHEET]
3597R–DFLASH–11/2012
24.
Ordering Information
Ordering Code Detail
Green Package Options (Pb/Halide-free/RoHS Compliant)
Notes: 1.
The shipping carrier option is not marked on the devices.
2.
Standard parts are shipped with the page size set to 528 bytes.
The user is able to configure these parts to a 512-byte page size, if desired.
3.
Parts ordered with suffix SL954 are shipped in bulk, with the page size set to 512 bytes.
Parts will have “954” or “SL954” marked on them.
4.
Parts ordered with suffix SL955 are shipped in tape and reel, with the page size set to 512 bytes.
Parts will have “955” or “SL955” marked on them.
Ordering Code(1)(2)
Package
Lead Finish
Operating
Voltage
fSCK (MHz)
Operation Range
AT45DB321D-MU
AT45DB321D-MU-SL954(3)
AT45DB321D-MU-SL955(4)
8M1-A
Matte Sn
2.7V to 3.6V
66
Industrial
(-40
C to 85C)
2.7V to 3.6V
AT45DB321D-MWU
AT45DB321D-MWU-SL954(3)
AT45DB321D-MWU-SL955(4)
8MW
AT45DB321D-SU
AT45DB321D-SU-SL954(3)
AT45DB321D-SU-SL955(4)
8S2
AT45DB321D-TU
28T
AT45DB321D-CU
24C3
Matte Sn
2.7V to 3.6V
66
AT45DB321D-MU-2.5
8M1-A
Matte Sn
2.5V to 3.6V
50
AT45DB321D-SU-2.5
8S2
Package Type
8M1-A
8-pad, 6 x 5 x 1.0mm, very thin micro lead-frame package MLF™ (VDFN)
8MW
8-pad, 8 x 6 x 1.0mm, very thin micro lead-frame package MLF (VDFN)
8S2
8-lead, 0.209in-wide, plastic gull wing small outline package (EIAJ SOIC)
28T
28-lead, 8mm x 13.4mm, plastic thin small outline package, type I (TSOP)
24C3
24-ball, 6mm x 8mm x 1.4mm ball grid array with a 1mm pitch 5 x 5 ball matrix
AT 4 5 D
3 2
MW U
1D–
B
Designator
Product Family
Device Density
32 = 32-megabit
Interface
1 = Serial
Package Option
M
=
8-pad, 6 x 5 x 1mm MLF (VDFN)
MW
=
8-pad, 8 x 6 x 1mm MLF (VDFN)
S
=
8-lead, 0.209" wide SOIC
T
=
28-lead, TSOP
Device Grade
U = Matte Sn lead finish, industrial
temperature range (-40°C to +85°C)
Device Revision
C
=
24 Ball BGA



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