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PCF85063TP Datasheet(PDF) 34 Page - NXP Semiconductors |
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PCF85063TP Datasheet(HTML) 34 Page - NXP Semiconductors |
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34 / 46 page ![]() PCF85063TP All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 2 — 15 April 2013 34 of 46 NXP Semiconductors PCF85063TP Tiny Real-Time Clock/calendar 14. Package outline Fig 27. Package outline SOT1069-2 (HWSON8) of PCF85063TP References Outline version European projection Issue date IEC JEDEC JEITA SOT1069-2 - - - MO-229 - - - sot1069-2_po 09-11-18 12-04-18 Unit mm max nom min 0.80 0.75 0.70 0.05 0.02 0.00 2.1 2.0 1.9 1.6 1.5 1.4 3.1 3.0 2.9 0.5 1.5 0.45 0.40 0.35 0.05 A(1) Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.75 mm SOT1069-2 A1 0.65 0.55 0.45 A2 0.2 A3 b 0.30 0.25 0.18 D(1) D2 E(1) E2 1.6 1.5 1.4 ee1 K 0.40 0.35 0.30 Lv 0.1 w 0.05 y 0.05 y1 0 1 2 mm scale X C y C y1 terminal 1 index area B A D E detail X A A3 A1 A2 terminal 1 index area b e1 e A C B v C w E2 L K D2 1 4 5 8 |
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