Characteristics

STPS3150-Y

4/7

Doc ID 018926 Rev 1

Figure 11.

Thermal resistance junction to ambient versus copper surface under each lead

Figure 9.

Forward voltage drop versus

forward current

Figure 10.

Forward voltage drop versus

forward current

I

(A)

FM

1

10

100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

V

(V)

FM

T =25°C

(maximum values)

j

T =125°C

(typical values)

j

T =125°C

(maximum values)

j

I

(A)

FM

1

10

100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

V

(V)

FM

T =25°C

(maximum values)

j

T =125°C

(typical values)

j

T =125°C

(maximum values)

j

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S (cm²)

Cu

Epoxy printed circuit board

FR4, copper thickness = 35 µm