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MCP6H84-E/ST Datasheet(PDF) 15 Page - Microchip Technology |
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MCP6H84-E/ST Datasheet(HTML) 15 Page - Microchip Technology |
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15 / 42 page ![]() 2012 Microchip Technology Inc. DS22320B-page 15 MCP6H81/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. 3.1 Analog Outputs The output pins are low-impedance voltage sources. 3.2 Analog Inputs The non-inverting and inverting inputs are high-impedance CMOS inputs with low bias currents. 3.3 Power Supply Pins The positive power supply (VDD) is 3.5V to 12V higher than the negative power supply (VSS). For normal operation, the other pins are at voltages between VSS and VDD. Typically, these parts can be used in single-supply operation or dual-supply operation. Also, VDD will need bypass capacitors. 3.4 Exposed Thermal Pad (EP) There is an internal electrical connection between the Exposed Thermal Pad (EP) and the VSS pin; they must be connected to the same potential on the Printed Circuit Board (PCB). This pad can be connected to a PCB ground plane to provide a larger heat sink. This improves the package thermal resistance ( JA). TABLE 3-1: PIN FUNCTION TABLE MCP6H81 MCP6H82 MCP6H84 Symbol Description SOIC 2x3 TDFN SOIC 2x3 TDFN SOIC, TSSOP 66 1 1 1 VOUT, VOUTA Analog Output (op amp A) 22 2 2 2 VIN–, VINA– Inverting Input (op amp A) 33 3 3 3 VIN+, VINA+ Non-Inverting Input (op amp A) 77 8 8 4 VDD Positive Power Supply —— 5 5 5 VINB+ Non-Inverting Input (op amp B) —— 6 6 6 VINB– Inverting Input (op amp B) —— 7 7 7 VOUTB Analog Output (op amp B) —— — — 8 VOUTC Analog Output (op amp C) —— — — 9 VINC– Inverting Input (op amp C) —— — — 10 VINC+ Non-Inverting Input (op amp C) 44 4 4 11 VSS Negative Power Supply —— — — 12 VIND+ Non-Inverting Input (op amp D) —— — — 13 VIND– Inverting Input (op amp D) —— — — 14 VOUTD Analog Output (op amp D) 1, 5, 8 1, 5, 8 — — — NC No Internal Connection — 9 — 9 — EP Exposed Thermal Pad (EP); must be connected to VSS. |
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