RSW PACKAGE

(TOP VIEW)

1

2

5

8

4

9

3

10

6

7

D–

GND

D+

OE

V

CC

S

RSW PACKAGE

(BOTTOM VIEW)

D+

1

2

3

10

4

9

5

8

6

7

GND

D–

S

V

CC

OE

TS3USB30E

www.ti.com

SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012

ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps)

1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE

Check for Samples: TS3USB30E

1

FEATURES

•

•

1.8-V Compatible Control-Pin Inputs

•

Operation

–

D+/D– Pins Tolerate up to 5.25V

•

•

•

•

Low Power Consumption (1

μA Max)

•

–3 dB Bandwidth = 900 MHz Typ

•

Latch-Up Performance Exceeds

•

ESD Performance Tested Per JESD 22

–

8000-V Human-Body Model (A114-B,

Class II)

–

1000-V Charged-Device Model (C101)

•

–

15000-V Human-Body Model

•

Packaged in 10-pin TQFN (1.4 mm × 1.8 mm)

APPLICATIONS

•

Routes Signals for USB 1.0, 1.1, and 2.0

DGS PACKAGE

(TOP VIEW)

(1)

Except OE and S inputs

(2)

High-voltage HBM is performed in addition to the standard

HBM testing (A114-B, Class II) and applies to I/O ports tested

with respect to GND only.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2008–2012, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.