1987254-2 datasheet(4/44 Pages) STMICROELECTRONICS

4 / 44 page

SOLARLOK Connectivity Systems for PV Manufacturers

te.com/solar

Catalog 3-1773458-7 | Issue Date 04/2011

Dimensions are in inches and millimeters unless otherwise specified.

Values in brackets are standard equivalents. Dimensions are shown

for reference purposes only. Specifications subject to change.

USA: 1-800-522-6752

Latin/S. America: +54 (0) 11-4733-2200

France: +33 (0) 1-3420-8686

Canada: +1-905-475-6222

Germany: +49 (0) 6251-133-1999

Netherlands: +31 (0) 73-6246-999

Mexico: +52 (0) 55-1106-0800

UK: +44 (0) 800-267666

China: +86 (0) 400-820-6015

Mechanical, Environmental and Electrical Testing Capabilities

Force-deflection curves are generated to verify that

spring contact properties meet design criteria.

3D X-ray computer tomography provides high

resolution three-dimensional non-destructive

analysis capability.

Contact resistance and temperature rise are measured

and recorded automatically. These parameters help to

establish/verify current carrying capacity, and de-rating

curves. Test samples are isolated to minimize the

influence of external variables such as air movement.

Components/assemblies are exposed to cold, heat,

moisture, and temperature change. Thermal shock

is accomplished with the 2-chamber method.

Environmental chambers operate from -70°C to +180°C

enabling simulation of real-world conditions.

Slow-motion bending and vibration testing simulates

line movements in the wire, stressing the crimped

termination. Industrial atmospheres are generated

with a gas mixture of SO2, H2S, NO2 and Cl2.

1987254-2 Datasheet(PDF) 4 Page - STMicroelectronics