LP5900TL-2.7SLASHNOPB datasheet(4/25 Pages) TI1

4 / 25 page

LP5900

SNVS358O – JULY 2005 – REVISED MAY 2013

www.ti.com

Thermal Properties

Junction to Ambient Thermal Resistance

θJA

(1)

JEDEC Board (DSBGA)

(2)

88°C/W

4L Cellphone Board (DSBGA)

157.4°C/W

JEDEC Board (WSON-6)(2)

77.3°C/W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

(2)

Detailed description of the board can be found in JESD51-7

Electrical Characteristics

Limits in standard typeface are for TA = 25ºC. Limits in boldface type apply over the full operating junction temperature range

(-40°C

≤ TJ ≤ +125°C). Unless otherwise noted, specifications apply to the LP5900 Typical Application Circuit (pg. 1) with: VIN

= VOUT (NOM) + 1.0V, VEN = 1.2V, CIN = COUT = 0.47 μF, IOUT = 1.0 mA.

(1), (2)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

VIN

Input Voltage

2.5

5.5

ΔVOUT

Output Voltage Tolerance

VIN = (VOUT(NOM) + 1.0V) to 5.5V, IOUT = 1

−2

mA to 150mA

Line Regulation

VIN = (VOUT(NOM) + 1.0V) to 5.5V, IOUT = 1

0.05

%/V

Load Regulation

IOUT = 1 mA to 150 mA

0.001

%/mA

ILOAD

Load Current

(3)

Maximum Output Current

150

Quiescent Current (4)

VEN = 1.2V, IOUT = 0 mA

VEN = 1.2V, IOUT = 150 mA

160

230

µA

VEN = 0.3V (Disabled)

0.003

1.0

Ground Current (5)

IOUT = 0 mA (VOUT = 2.5V)

µA

VDO

Dropout Voltage(6)

IOUT = 150 mA

150

ISC

Short Circuit Current Limit

(7)

300

PSRR

Power Supply Rejection Ratio

f = 100 Hz, IOUT = 150 mA

(8)

f = 1 kHz, IOUT = 150 mA

f = 10 kHz, IOUT = 150 mA

f = 50 kHz, IOUT = 150 mA

f = 100 kHz, IOUT = 150 mA

Output Noise Voltage

BW = 10 Hz to 100

IOUT = 0 mA

μVRMS

(8)

kHz, VIN = 4.2V

IOUT = 1 mA

IOUT = 150 mA

6.5

TSHUTDOWN

Thermal Shutdown

Temperature

160

ºC

Hysteresis

VIL

Low Input Threshold (VEN)

VIN = 2.5V to 5.5V

0.4

VIH

High Input Threshold (VEN)

VIN = 2.5V to 5.5V

1.2

(1)

All voltages are with respect to the potential at the GND pin.

(2)

Min and Max limits are specified by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most

likely norm.

(3)

The device maintains a stable, regulated output voltage without a load current.

(4)

Quiescent current is defined here as the difference in current between the input voltage source and the load at VOUT.

(5)

Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device.

(6)

Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mV below its

nominal value. This parameter only applies to output voltages above 2.5V.

(7)

Short Circuit Current is measured with VOUT pulled to 0v and VIN worst case = 6.0V.

(8)

This specification is specified by design.

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