ADS7809

2

SBAS017C

www.ti.com

CAP ....................................... Indefinite Short to AGND2,

Ground Voltage Differences: DGND, AGND2 .................................

±0.3V

Maximum Junction Temperature .................................................. +165

°C

Internal Power Dissipation ............................................................ 700mW

Lead Temperature (soldering, 10s) .............................................. +300

°C

MINIMUM

SIGNAL-TO-

MAXIMUM

NO MISSING

(NOISE +

SPECIFIED

LINEARITY

CODE LEVEL DISTORTION)

PACKAGE-

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

ERROR (LSB)

(LSB)

RATIO (dB)

LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

ADS7809U

±315

83

SO-20

DW

–40

°C to +85°C

ADS7809U

ADS7809U

Rail, 38

"

""

"

"

"

"

"

ADS7809U/1K

Tape and Reel, 1000

ADS7809UB

±216

86

""

"

ADS7809UB

ADS7809UB

Rail, 38

"

""

"

"

"

"

"

ADS7809UB/1K

Tape and Reel, 1000

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.

NOTE: (1) Stresses above those listed under

Absolute Maximum Ratings may

cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.