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3

PCM1704

PIN ASSIGNMENTS

PIN CONFIGURATION

TOP VIEW

SOIC

PACKAGE INFORMATION

PACKAGE

TEMPERATURE

DRAWING

PRODUCT

PACKAGE

RANGE

PCM1704U

20-Lead SOIC

–25

°C to +85°C

248

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.

ABSOLUTE MAXIMUM RATINGS

Supply Voltage Differences ..............................................................

±0.1V

GND Voltage Differences .................................................................

±0.1V

Digital Input Voltage

Input Current (any pins except supply pins) ...................................

±10mA

Power Dissipation .......................................................................... 300mW

Operating Temperature Range ......................................... –25

°C to +85°C

Storage Temperature ...................................................... –55

°C to +125°C

Lead Temperature (soldering, 5s) ................................................. +260

°C

Package Temperature (reflow, 10s) .............................................. +235

°C

PIN

NAME

I/O

FUNCTION

1

DATA

IN

Serial Audio Data Input.

2

BCLK

IN

Bit Clock Input for Serial Audio Data.

3

NC

—

No Connection.

—

Digital Power, –5V.

5

DGND

—

Digital Ground.

—

Digital Power, +5V.

7

WCLK

IN

Data Latch Enable Input.

8

NC

—

No Connection.

9

20BIT

IN

10

INVERT

IN

11

—

Analog Power, +5V.

12

BPO DC

—

Bipolar Offset Decoupling Capacitor.

13

NC

—

No Connection.

14

OUT

Current Output for Audio Signal.

15

AGND

—

Analog Ground.

16

AGND

—

Analog Ground.

17

SERVO DC

—

Servo Amplifier Decoupling Capacitor.

18

NC

—

No Connection.

19

REF DC

—

Band Gap Reference Decoupling Capacitor.

20

—

Analog Power, –5V.

to DGND.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

PCM1704U

DATA

BCLK

NC

–V

DD

DGND

+V

DD

WCLK

NC

20BIT

INVERT

–V

CC

REF DC

NC

SERVO DC

AGND

AGND

I

OUT

NC

BPO DC

+V

CC