2PB709BRL_2PB709BSL

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Product data sheet

Rev. 1 — 28 June 2010

3 of 13

NXP Semiconductors

2PB709BRL; 2PB709BSL

50 V, 200 mA PNP general-purpose transistors

[1]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

total power dissipation

[1] -250

mW

junction temperature

-

150

°C

ambient temperature

−55

+150

°C

storage temperature

−65

+150

°C

FR4 PCB, standard footprint

Fig 1.

Power derating curve

Table 6.

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

−75

175

125

25

75

−25

006aaa990

100

200

300

(mW)

0

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from junction

to ambient

in free air

[1] -

-

500

K/W

thermal resistance from junction

to solder point

-

-

140

K/W