SMA6F

Characteristics

Doc ID 14996 Rev 2

5/9

Figure 6.

Peak forward voltage drop versus

peak forward current (typical

values)

Figure 7.

Relative variation of thermal

impedance junction to ambient

versus pulse duration

Figure 8.

Thermal resistance junction to

ambient versus copper surface

under each lead

Figure 9.

Leakage current versus junction

temperature (typical values)

I

(A)

FM

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

0.0

0.5

1.0

1.5

2.0

T

T

V

(V)

FM

0.00

0.01

0.10

1.00

1.0E-03

1.0E-021.0E-011.0E+00

1.0E+011.0E+021.0E+03

On recommended pad layout.

Printed circuit board, FR4

copper thickness = 35 µm

copper surface = 1 cm²

t (S)

p

0

20

40

60

80

100

120

140

160

180

200

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0

S

(cm )

CU

2

Printed circuit board, FR4

copper thickness = 35 µm

I (nA)

R

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

25

50

75

100

125

150

175

V

V

V

T (°C)

j