BC847_BC547_SER_7

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 07 — 10 December 2008

5 of 15

NXP Semiconductors

BC847/BC547 series

45 V, 100 mA NPN general-purpose transistors

5.

Limiting values

[1]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2]

Reflow soldering is the only recommended soldering method.

[3]

Device mounted on an FR4 PCB with 60

µm copper strip line, standard footprint.

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Reflow soldering is the only recommended soldering method.

[3]

Device mounted on an FR4 PCB with 60

µm copper strip line, standard footprint.

Table 6.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

collector-base voltage

open emitter

-

50

V

collector-emitter voltage

open base

-

45

V

emitter-base voltage

open collector

-

6

V

collector current

-

100

mA

peak collector current

single pulse;

-

200

mA

peak base current

single pulse;

-

100

mA

total power dissipation

SOT23

[1] -

250

mW

SOT323

[1] -

200

mW

SOT416

[1] -

150

mW

SOT883

[2][3] -

250

mW

SOT54

[1] -

500

mW

junction temperature

-

150

°C

ambient temperature

−65

+150

°C

storage temperature

−65

+150

°C

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

SOT23

[1] -

-

500

K/W

SOT323

[1] -

-

625

K/W

SOT416

[1] -

-

833

K/W

SOT883

[2][3] -

-

500

K/W

SOT54

[1] -

-

250

K/W