BA4580RF datasheet(43/49 Pages) ROHM

43 / 49 page

Technical Note

43/48

BA4558F,BA4558R F/FV/FVM,BA4560F,BA4560RF/FV/FVM,BA4564RFVBA4580RF/FVM,BA4584FV,

BA4584RF/FV,BA8522RF/FV/FVM,BA15218F,BA14741F,BA15532F,BA4510F/FV,BA2115F/FVM

www.rohm.com

2011.08 - Rev.B

●

Derating curve

Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated

when it consumed power, and the temperature of IC ship becomes higher than ambient temperature. The temperature that

can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.

Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal

resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum

value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame

of the package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal

resistance, represented by the symbol θj-a[℃/W]. The temperature of IC inside the package can be estimated by this

thermal resistance. Fig.319 (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient

temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below:

θja = (Tj-Ta) / Pd

[℃/W]

・・・・・

(Ⅰ)

Derating curve in Fig.319 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that

can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at

certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip

size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of

package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Fig.320(c), ～, (f)

show a derating curve for an example of BA4558, BA4558R, BA4560, BA4560R, BA4564R, BA4580R, BA4584, BA4584R,

BA8522R, BA15218, BA14741, BA15532, BA4510, BA2115.

(*37)

(*38)

(*39)

(*40)

(*41)

(*42)

(*43)

(*44)

Unit

6.2

5.5

4.7

7.0

5.3

6.2

5.5

4.9

[mW/℃]

When using the unit above Ta=25[℃], subtract the value above per degree[℃]. Permissible dissipation is the value.

When FR4 glass epoxy board 70[mm]×70[mm]×1.6[mm] (cooper foil area below 3[%]) is mounted.

Fig. 320 Derating curve

200

400

600

800

1000

100

125

周囲温度 Ta [℃]

200

400

600

800

1000

100

125

周囲温度 Ta [℃]

200

400

600

800

1000

100

125

周囲温度 Ta [℃]

200

400

600

800

1000

100

125

周囲温度 Ta [℃]

(a) Thermal resistance

(b) Derating curve

Fig. 319 Thermal resistance and derating curve

(c)BA4558R/BA4560R/BA4580R/BA8522R/BA2115 family

(d)BA4564R/BA4584/BA4584R family

(e)BA4558/BA4560/BA15218/BA15532/BA4510 family

(f)BA14741F

550mW (*43)

620mW (*42)

490mW (*44)

870mW (*40)

610mW (*41)

BA4558F

BA4560F

BA15218F

BA4510F

BA15532F

BA4510F

780mW (*37)

690mW (*38)

590mW (*39)

BA4558RF

BA4564RF

BA4580RF

BA8522RF

BA2115F

BA4558RFVM

BA4564RFVM

BA4580RFVM

BA8522RFVM

BA2115FVM

BA4558RFV

BA4564RFV

BA8522RFV

BA4564RFV

BA4584RFV

BA4584RF

BA4584FV

BA14741F

050

100

125

150

Pd (max)

LSIの消費電力 [W]

θ' ja2

θ' ja1

Tj ' (max)

θja2 < θja1

周囲温度 Ta [℃ ]

θ ja2

θ ja1

Tj (max)

周囲温度 Ta [℃]

チップ表面温度 Tj [℃]

消費電力 P [W]

θja = ( Tj ーTa ) / Pd [℃/W]

Ambient temperature Ta [℃]

Chip surface temperature Tj [℃]

Power dissipation P [W]

Power dissipation of LSI [W]

Ambient temperature Ta [℃]

Ambient Temperature Ta [℃]

Ambient temperature Ta [℃]

Ambient Temperature Ta [℃]

Ambient temperature Ta [℃]

BA4580RF Datasheet(PDF) 43 Page - Rohm

BA4580RF Datasheet(HTML) 43 Page - Rohm

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49

Datasheet Download

Link URL