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EP2C50 Datasheet(PDF) 44 Page - Altera Corporation |
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EP2C50 Datasheet(HTML) 44 Page - Altera Corporation |
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44 / 182 page ![]() 44 Package Information Datasheet for Mature Altera Devices Package Outlines Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation Package Outlines The package outlines on the following pages are listed in order of ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95. 1 All lidless flip chip and wire bond packages are non-vented packages. All other flip chip packages are vented packages. |
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