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LPC81XM Datasheet(PDF) 63 Page - NXP Semiconductors |
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LPC81XM Datasheet(HTML) 63 Page - NXP Semiconductors |
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63 / 71 page ![]() LPC81xM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 29 July 2013 63 of 71 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 16. Soldering Fig 40. Reflow soldering of the TSSOP16 package DIMENSIONS in mm Ay By D1 D2 Gy Hy P1 C Gx sot403-1_fr Hx SOT403-1 solder land occupied area Footprint information for reflow soldering of TSSOP16 package Ay By Gy C Hy Hx Gx P1 Generic footprint pattern Refer to the package outline drawing for actual layout P2 (0.125) (0.125) D1 D2 (4x) P2 7.200 4.500 1.350 0.400 0.600 5.600 5.300 7.450 5.800 0.650 0.750 |
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