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APW7145 Datasheet(PDF) 2 Page - Anpec Electronics Coropration |
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APW7145 Datasheet(HTML) 2 Page - Anpec Electronics Coropration |
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2 / 23 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.7 - Mar., 2011 APW7145 www.anpec.com.tw 2 Ordering and Marking Information Absolute Maximum Ratings (Note 1) Symbol Parameter Rating Unit VIN VIN Supply Voltage (VIN to AGND) -0.3 ~ 15 V > 100ns -1 ~ VIN+1 VLX LX to GND Voltage < 100ns - 5 ~ VIN+5 V PGND to AGND Voltage -0.3 ~ +0.3 V EN to AGND Voltage -0.3 ~ VIN+0.3 V FB, COMP to AGND Voltage -0.3 ~ 6 V PD Power Dissipation Internally Limited W Maximum Junction Temperature 150 oC TSTG Storage Temperature -65 ~ 150 oC TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 oC Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Pin Configuration The Pin 7 must be connected to the Exposed Pad NC VIN AGND FB 1 2 3 4 PGND LX EN COMP 8 7 6 5 9 LX APW7145 SOP-8P (Top View) DFN4x4-8 (Top View) 1 6 5 4 3 2 8 7 PGND EN LX COMP VIN FB NC AGND APW7145 APW7145 Package Code KA : SOP-8P QA: DFN4x4-8 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device Handling Code Temperature Range Package Code Assembly Material APW7145 KA : XXXXX - Date Code APW7145 XXXXX APW7145 QA : APW7145 XXXXX XXXXX - Date Code Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom- mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability |
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