Copyright

© ANPEC Electronics Corp.

Rev. A.1 - Feb., 2011

APW8821

www.anpec.com.tw

3

Symbol

Parameter

Rating

Unit

VCC Supply Voltage (VCC to GND)

-0.3 ~ 7

V

BOOT Supply Voltage (BOOT to GND )

-0.3 ~ 35

V

BOOT Supply Voltage (BOOT to PHASE)

-0.3 ~ 7

V

All Other Pins (FB, VOUT, POK, and REFIN to GND)

V

UGATE Voltage (UGATE to PHASE)

<20ns Pulse Width

>20ns Pulse Width

V

LGATE/OCSET Voltage (LGATE to GND)

<20ns Pulse Width

>20ns Pulse Width

V

PHASE Voltage (PHASE to GND)

<20ns Pulse Width

>20ns Pulse Width

-5 ~ 35

-1 ~ 30

V

Maximum Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance -Junction to Ambient

(Note 2)

TDFN3x3-10

55

°C/W

Note 2:

θ

pad of package is soldered directly on the PCB.

Symbol

Parameter

Range

Unit

V

IN

Converter Input Voltage

1.8 ~ 28

V

VCC Supply Voltage

4.5 ~ 5.5

V

Converter Output Voltage (external REFIN input)

0.5 ~ 2.5

V

V

OUT

Converter Output Voltage (internal FB setting)

0.5 ~ 3.3

V

Converter Output Current

~ 25

A

T

A

Ambient Temperature

-40 ~ 85

T

J

Junction Temperature

-40 ~ 125

Note 3 : Refer to the typical application circuit.