Copyright

© ANPEC Electronics Corp.

Rev. A.6 - Dec., 2011

www.anpec.com.tw

3

APA2174

Symbol

Parameter

Rating

Unit

PVDD to VDD Voltage

-0.3 to 0.3

PGND to GND Voltage

-0.3 to 0.3

Supply Voltage (VDD and PVDD to GND and PGND)

-0.3 to 5.5

V

Input Voltage (RSD and LSD to GND)

VSS and CVSS to GND and PGND Voltage

-5.5 to 0.3

ROUT and LOUT to GND Voltage

CPP to PGND Voltage

CPN to PGND Voltage

V

Maximum Junction Temperature

150

Storage Temperature Range

-65 to +150

Maximum Soldering Temperature Range, 10 Seconds

260

Power Dissipation

Internally Limited

W

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Range

Symbol

Parameter

Min.

Max.

Unit

Supply Voltage

2.3

4.5

High Level Threshold Voltage

RSD, LSD

1

-

Low Level Threshold Voltage

RSD, LSD

-

0.35

V

Input Resistance

1

47

Feedback Resistance

4.7

100

k

Ω

Load Resistance

500

-

Ω

Maximum Capacitive Load

-

400

pF

Operating Ambient Temperature Range

-40

85

Operating Junction Temperature Range

-40

125

Recommended Operating Conditions

Thermal Characteristics

Symbol

Parame ter

Typical Value

Unit

θ

JA

TQFN4x4-20B

TSSOP-16

SOP-14

45

100

110

θ

JC

TQFN4x4-20B

8

Note 2: Please refer to “ Layout Recommendation”, the Thermal Pad on the bottom of the IC should soldered directly to the PCB’s

Thermal Pad area that with several thermal vias connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with 2oz

copper thickness.

Note 3: The case temperature is measured at the center of the Thermal Pad on the underside of the TQFN4x4-20B package.