W25Q80BVCIP datasheet(4/74 Pages) WINBOND

4 / 74 page

W25Q128BV

- 4 -

7.2.39

Read Security Registers (48h) ...........................................................................................59

ELECTRICAL CHARACTERISTICS .............................................................................................. 60

8.1

Absolute Maximum Ratings (1)(2)...................................................................................... 60

8.2

Operating Ranges .............................................................................................................. 60

8.3

Power-up Timing and Write Inhibit Threshold(1) ............................................................... 61

8.4

DC Electrical Characteristics.............................................................................................. 62

8.5

AC Measurement Conditions ............................................................................................. 63

8.6

AC Electrical Characteristics .............................................................................................. 64

8.7

AC Electrical Characteristics (cont’d)................................................................................. 65

8.8

Serial Output Timing........................................................................................................... 66

8.9

Serial Input Timing.............................................................................................................. 66

8.10

HOLD Timing...................................................................................................................... 66

8.11

WP Timing .......................................................................................................................... 66

PACKAGE SPECIFICATION.......................................................................................................... 67

9.1

8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 67

9.2

16-Pin SOIC 300-mil (Package Code F) ............................................................................ 68

9.3

24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 Ball Array)........................................... 69

9.4

24-Ball TFBGA 8x6-mm (Package Code C, 6x4 Ball Array).............................................. 70

10.

ORDERING INFORMATION .......................................................................................................... 71

10.1

Valid Part Numbers and Top Side Marking........................................................................ 72

11.

REVISION HISTORY...................................................................................................................... 73

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