Material Composition Specification

DPAK Case

Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297 mg

Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%

www.centr a lsemi.com

R3 (25-February 2013)

Component

Material

Material

Substance

CAS No.

Substance

(%wt)

(mg)

(%wt)

(mg)

(ppm)

active device

doped Si

0.75%

2.2

Si

7440-21-3

0.74%

2.2

7,407

bond wire

aluminum

1.55%

4.6

Al

7429-90-5

1.55%

4.6

15,488

leadframe

Cu alloy

52.53%

156

Cu

7440-50-8

52.46%

155.8

524,579

Fe

7439-89-6

0.07%

0.2

673

die attach

high temperature

solder paste

4.04%

12

Pb

7439-92-1

3.74%

11.1

37,374

Sn

7440-31-5

0.2%

0.6

2,020

Ag

7440-22-4

0.1%

0.3

1,010

encapsulation*

EMC

38.25%

113.6

silica

7631-86-9

26.01%

77.26

260,135

epoxy resin

29690-82-2

7.65%

22.73

76,532

phenol resin

9003-35-4

3.82%

11.35

38,215

Sb2O3

1309-64-4

0.38%

1.13

3,805

Br

7726-95-6

0.38%

1.13

3,805

EMC GREEN

38.25%

113.6

silica (fused) 60676-86-0

29.44%

87.43

294,377

epoxy resin

29690-82-2

3.82%

11.36

38,249

phenol resin

9003-35-4

3.71%

11.02

37,104

carbon black

1333-86-4

0.11%

0.34

1,145

metal

hydroxide

1309-42-8

1.16%

3.45

11,616

plating**

tin/lead process

2.9%

8.6

Sn

7440-31-5

2.6%

7.74

26,061

Pb

7439-92-1

0.29%

0.86

2,896

matte tin

2.9%

8.6

Sn

7440-31-5

2.90%

8.60

28,956

*EMC GREEN molding compound is Halogen-Free.

**For Lead Free plating, add suffix “LEAD FREE” to part number.

For Tin/Lead plating, add suffix “TIN/LEAD” to part number.

No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability.

Disclaimer

The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no

guarantee to completeness or accuracy, as some information is derived from data sources outside the company.