LMP2021 datasheet(2/31 Pages) TI

2 / 31 page

1/2

LMP2022

0.1 PF

1/2

LMP2022

0.1 PF

5.1 k:

0.1%

5.1 k:

0.1%

200:

280:

LMP2021

ADC161S626

VR = 1/2 VA

1 k:

EMI

180:

470 pF

VA = 5V

LMP2021, LMP2022

SNOSAY9E – SEPTEMBER 2008 – REVISED MARGH 2013

www.ti.com

TYPICAL APPLICATION

Figure 1. Bridge Amplifier

The LMP2021/LMP2022 support systems with up to 24 bits of accuracy.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

ESD Tolerance(3)

Human Body Model

2000V

Machine Model

200V

Charge Device Model

1000V

VIN Differential

±VS

Supply Voltage (VS = V

+ – V−)

6.0V

All Other Pins

V+ + 0.3V, V−

− 0.3V

Output Short-Circuit Duration to V+ or V−(4)

Storage Temperature Range

−65°C to 150°C

Junction Temperature(5)

150°C max

Soldering Information

Infrared or Convection (20 sec)

235°C

Wave Soldering Lead Temperature (10 sec)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

Human Body Model per MIL-STD-883, Method 3015.7. Machine Model, per JESD22-A115-A. Field-Induced Charge-Device Model, per

JESD22-C101-C.

(4)

Package power dissipation should be observed.

(5)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.

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