Data Sheet

AD8205

Rev. | Page 5 of 12

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

Figure 2. Metallization Diagram

NC = NO CONNECT

AD8205

TOP VIEW

(Not to Scale)

–IN

1

GND

2

NC

4

+IN

V+

OUT

8

7

6

5

Figure 3. Pin Configuration

Table 3. Pin Function Descriptions

Pin No.

Mnemonic

X

Y

1

−IN

−206

508

2

GND

−447

57

3

−432

−457

4

NC

N/A

N/A

5

OUT

444

−472

6

V+

444

−203

7

456

434

8

+IN

203

509

Die size is 1170 µm by 1280 µm.

Die thickness is 13 mil.

Minimum passivation opening (minimum bond pad size) is

92 µm × 92 µm.

Passivation type is 8KA USG (Oxide) + 10KA Oxynitride.

Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu.

Backside potential is V+.

D