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TSL2583 Datasheet(PDF) 27 Page - ams AG |
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TSL2583 Datasheet(HTML) 27 Page - ams AG |
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27 / 33 page ![]() TSL2581, TSL2583 LIGHT-TO-DIGITAL CONVERTER TAOS134A − JULY 2012 26 r r Copyright E 2012, TAOS Inc. The LUMENOLOGY r Company www.taosinc.com PACKAGE INFORMATION PACKAGE CS Six-Lead Chipscale 1750 500 BSC 1250 6 y 100 415 + 20 710 + 45 500 BSC 500 BSC 375 + 30 375 + 30 TOP VIEW BOTTOM VIEW END VIEW 6 y j 210 + 30 PIN OUT Lead Free Pb 442 + 10 442 + 10 PHOTODIODE ARRAY BOTTOM VIEW SDA 6 INT 5 SCL 4 1 VDD 2 ADDR SEL 3 GND 8 Nominal CL of Solder Contacts CL of Photodiode Array Area C L of Solder Contacts of Photodiode Array Area C L 139 Nominal PIN 1 PIN 1 NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted. B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%). C. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53. D. This drawing is subject to change without notice. Figure 10. Package CS — Six-Lead Chipscale Packaging Configuration |
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