E981.10

2/19

ELMOS Semiconductor AG

Data Sheet

QM-No.: 25DS0007E.02 2010-06-16

1.1 Pin description

1 Pinout

No

Name

Pull

Description

Connection

1

VDD_IO

S

-

Supply host interface

See specification

2

SILIM

D_I

Down

Reduced overcurrent

limitation threshold

See specification

3

GND2

S

-

Ground

Connect to system ground

4

TEST

D_I

Down

Test

Connect to system ground

5

NC

Not internally connected

Connect to system ground

6

ATB

A_IO

-

Test

Not connected or connect to

system ground (prefered)

7

VDD

S

-

Internal supply I/O

See specification

8

VREGO

HV_A_IO

-

Regulator control output

See specification

9

NC

Not internally connected

Not connected (reduce risk

of leakage or short circuit to

neighbour pins)

10

VDDH

S

-

Main supply

See specification

11

NC

Not internally connected

Not connected (reduce risk

of leakage or short circuit to

neighbour pins)

12

C/Q

HV_A_IO

-

IO-Link interface

See specification

13

NC

Not internally connected

Not connected (reduce risk

of leakage or short circuit to

neighbour pins)

14

GND1

S

-

Ground

Connect to system ground

15

ILIM

D_O

-

Overcurrent signal

See specification

16

WAKE

D_O

-

Wake-up request

See specification

17

RXD

D_O

-

Receive signal

See specification

18

TXD

D_I

Up

Transmit signal

See specification

19

SPEED

D_I

Down

Baud rate / slope control

See specification

20

TXEN

D_I

Down

Transmitter enable

See specification

21

GND3,

Exposed

die pad

S

-

The exposed die pad is the

backside metal pad of the package Connect to system ground

1) D = Digital, A = Analog, S = Supply, I = Input, O = Output, HV = High Voltage