LMV358MM datasheet(2/45 Pages) NSC

2 / 45 page

LMV321-N, LMV321-N-Q1, LMV358-N, LMV358-N-Q1

LMV324-N, LMV324-N-Q1

SNOS012I – AUGUST 2000 – REVISED FEBRUARY 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

ESD Tolerance (3)

Human Body Model

LMV358-N/LMV324-N

2000V

LMV321-N

900V

Machine Model

100V

Differential Input Voltage

±Supply Voltage

Input Voltage

−0.3V to +Supply Voltage

Supply Voltage (V+–V −)

5.5V

Output Short Circuit to V +

(4)

Output Short Circuit to V −

(5)

Soldering Information

Infrared or Convection (30 sec)

260°C

Storage Temp. Range

−65°C to 150°C

Junction Temperature (6)

150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for

availability and specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC

(4)

Shorting output to V+ will adversely affect reliability.

(5)

Shorting output to V-will adversely affect reliability.

(6)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

Operating Ratings

(1)

Supply Voltage

2.7V to 5.5V

Temperature Range (2)

LMV321-N/LMV358-N/LMV324-N

−40°C to +125°C

Thermal Resistance (

θ JA)

(3)

5-pin SC70

478°C/W

5-pin SOT23

265°C/W

8-Pin SOIC

190°C/W

8-Pin MSOP

235°C/W

14-Pin SOIC

145°C/W

14-Pin TSSOP

155°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test

conditions, see the Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

(3)

All numbers are typical, and apply for packages soldered directly onto a PC board in still air.

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Product Folder Links: LMV321-N LMV321-N-Q1 LMV358-N LMV358-N-Q1 LMV324-N LMV324-N-Q1

LMV358MM Datasheet(PDF) 2 Page - National Semiconductor (TI)

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