BCP52 datasheet(1/22 Pages) NXP

Part #	BCP52

Description	PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.

PDF	22 Pages

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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1 / 22 page

1.

Product profile

1.1 General description

PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.

[1]

Valid for all available selection groups.

1.2 Features and benefits

 High current

 Three current gain selections

 High power dissipation capability

 Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)

 Leadless very small SMD plastic package with medium power capability (SOT1061)

 AEC-Q101 qualified

1.3 Applications

 Linear voltage regulators

 High-side switches

 Battery-driven devices

 Power management

 MOSFET drivers

 Amplifiers

1.4 Quick reference data

BCP52; BCX52; BC52PA

60 V, 1 A PNP medium power transistors

Rev. 9 — 18 October 2011

Product data sheet

Table 1.

Product overview

Type number[1]

Package

NPN complement

NXP

JEITA

JEDEC

BCP52

SOT223

SC-73

-

BCP55

BCX52

SOT89

SC-62

TO-243

BCX55

BC52PA

SOT1061

-

BC55PA

Table 2.

Quick reference data

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

VCEO

collector-emitter voltage

open base

-

60

V

IC

collector current

-

1A

ICM

peak collector current

single pulse; tp  1ms

-

2A

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