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ZADCS0882 Datasheet(PDF) 24 Page - List of Unclassifed Manufacturers

Part # ZADCS0882
Description  8-Bit, 300ksps, ADC Family
PDF  27 Pages
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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ZADCS0882 Datasheet(HTML) 24 Page - List of Unclassifed Manufacturers

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ZADCS0882/0842/0822
8-Bit, 300ksps, ADC Family
Data Sheet
October 12, 2011
© 2011 Zentrum Mikroelektronik Dresden AG — Rev. 2.0
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is PRELIMINARY and subject to
changes without notice.
24 of 26
3
Layout
To achieve optimum conversion performance care must be taken in design and layout of the application
board. It is highly recommended to use printed circuit boards instead of wire wrap designs and to establish a
single point star connection ground system towards AGND (see Figure 19).
For optimal noise performance the star point should be located very close to the AGND pin of the converter.
The ground return to the power supply should be as short as possible and low impedance.
All other analog ground points of external circuitry that is related to the A/D converter as well as the DGND pin
of the device should be connected to this ground point too. Any other digital ground system should be kept
apart as far as possible and connect on the power supply point only.
Analog and digital signal domains should also be separated as well as possible and analog input signals
should be shielded by AGND ground planes from electromagnetic interferences. Four-layer PCB boards that
allow smaller vertical distances between the ground plane and the shielded signals do generally show a better
performance than two-layer boards.
The sampling phase is the most critical portion of the overall conversion timing for signal distortion. If possible,
the switching of any high power devices or nearby digital logic should be avoided during the sampling phase
of the converter.
Current consumption vs. Sample Rate
External Clock Mode, External VREF, fSCLK = 3.3MHz
1
10
100
1000
10000
1
10
100
1000
Sample Rate (ksps)
Figure 18: Supply Current versus Sampling Rate
Figure 19: Optimal Power-Supply Grounding System
COM
DGND
D
Other
Digital
CircuitryVDD
VDD1
Optional
R = 10Ω
ZADCS08x2
Family
GND
VDD2
(+2.7 … +5.25V)
The fully differential internal architecture of the ZADCS08x2 family ensures very good suppression of power
supply noise. Nevertheless, the SAR architecture is generally sensitive to glitches or sudden changes of the
power supply that occur shortly before the latching of the comparator output. It is therefore recommended to
bypass the power supply connection very close to the device with capacitors of 0.1µF (ceramic) and >1µF
(electrolytic). In case of a noisy supply, an additional series resistor of 5 to 10 ohms can be used to low-pass
filter the supply voltage. The reference voltage should always be bypassed with capacitors of 0.1µF (ceramic)
and ≥ 4.7µF (electrolytic) as close as possible to the VREF pin. If VREF is provided by an external source, any
series resistance in the VREF supply path can cause a gain error of the converter. During conversion, a DC
current of about 100µA is drawn through the VREF pin that could cause a noticeable voltage drop across the
resistance.



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