IO10PDB0V0 datasheet(187/197 Pages) MICROSEMI

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SmartFusion Customizable System-on-Chip (cSoC)

Re vi s i on 12

6 - 5

Revision 8

(continued)

The description of "In-application programming (IAP)" methodology was changed to

state the difference for A2F060 and A2F500 compared to A2F200 (SAR 37808).

4-7

The "Global I/O Naming Conventions" section is new (SARs 28996, 31147). The

description for IO "User Pins" was revised accordingly and moved out of the table and

into a new section: "User I/O Naming Conventions".

5-6, 5-6

The descriptions for "MAINXIN" and "MAINXOUT" were revised to state how they

should be handled if using an external RC network or clock input (SAR 32594).

5-8

The description and type was revised for the "MSS_RESET_N" pin (SAR 34133).

5-9

The "TQ144" section and pin table for A2F060 are new (SAR 36246).

5-18

Revision 7

(August 2011)

The title of the datasheet was changed from SmartFusion Intelligent Mixed Signal

FPGAs to SmartFusion Customizable System-on-Chip (cSoC). Terminology

throughout was changed accordingly. The term cSoC defines a category of devices

that include at least FPGA fabric and a processor subsystem of some sort. It can also

include any of the following: analog, SerDes, ASIC blocks, customer specific IP, or

application-specific IP. SmartFusion is Microsemi’s first cSoC (SAR 33071).

N/A

The "SmartFusion cSoC Family Product Table" was revised to remove the note

stating that the A2F060 device is under definition and subject to change (SAR 33070).

A note was added for EMC, stating that it is not available on A2F500 for the PQ208

package (SAR 33041).

The "SmartFusion cSoC Device Status" table was revised. The status for A2F060

CS288 and FG256 moved from Advance to Preliminary. A2F200 PQ208 and A2F500

PQ208 moved from Advance to Production (SAR 33069).

III

The "Package I/Os: MSS + FPGA I/Os" table was revised. The number of direct

analog inputs for A2F060 packages increased from 6 to 11. The number of MSS I/Os

for the A2F060 FG256 package increased from 25 to 26 (SAR 33070). A note was

added stating that EMC is not available for the A2F500 PQ208 package (SAR 33041).

III

The note associated with the "SmartFusion cSoC System Architecture" diagram was

corrected from "Architecture for A2F500" to "Architecture for A2F200" (SAR 32578).

The Licensed DPA Logo was added to the "Product Ordering Codes" section. The

trademarked Licensed DPA Logo identifies that a product is covered by a DPA

counter-measures license from Cryptography Research (SAR 32151).

The "Security" section and "Secure Programming" section were updated to clarify that

although no existing security measures can give an absolute guarantee, SmartFusion

cSoCs implement the best security available in the industry (SAR 32865).

1-2, 4-9

Storage temperature, TSTG, and junction temperature, TJ, were added to Table 2-1 •

Absolute Maximum Ratings (SAR 30863).

2-1

AC/DC characteristics for A2F060 were added to the "SmartFusion DC and Switching

Characteristics" chapter (SAR 33132). The following tables were updated:

Table 2-14 • Different Components Contributing to Dynamic Power Consumption in

SmartFusion cSoCs

Table 2-15 • Different Components Contributing to the Static Power Consumption in

SmartFusion cSoCs

Table 2-90 • eNVM Block Timing, Worst Commercial Case Conditions: TJ = 85°C,

VCC = 1.425 V

Table 2-98 • Analog Sigma-Delta DAC

Table 2-100 • SPI Characteristics

2-12

2-13

2-75

2-84

2-88

Revision

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IO10PDB0V0 Datasheet(PDF) 187 Page - Microsemi Corporation

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