Seemechanicaldrawingsfordimensions.

DCTPACKAGE

(TOP VIEW)

DCUPACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOMVIEW)

1

V

CC

8

1A

2

7

1B

1C

3

6

2C

2B

4

5

GND

2A

3

6

2B

2C

8

1

V

CC

1A

5

GND

4

2A

2

7

1C

1B

GND

5

4

2A

3 6

2B

2C

2 7

1C

1B

8

V

CC

1

1A

SN74LVC2G66

www.ti.com

SCES325K – JULY 2001 – REVISED JANUARY 2014

SN74LVC2G66 Dual Bilateral Analog Switch

Check for Samples: SN74LVC2G66

1

FEATURES

DESCRIPTION

This dual bilateral analog switch is designed for

2

•

Available in the Texas Instruments

NanoFree™ Package

The SN74LVC2G66 device can handle both analog

•

and

digital

signals.

The

SN74LVC2G66

device

•

Inputs Accept Voltages to 5.5 V

permits signals with amplitudes of up to 5.5 V (peak)

•

to be transmitted in either direction.

•

High On-Off Output Voltage Ratio

NanoFree™

package

technology

is

a

major

•

High Degree of Linearity

breakthrough in IC packaging concepts, using the die

as the package.

•

High Speed, Typically 0.5 ns

Each switch section has its own enable-input control

•

Rail-to-Rail Input/Output

(C). A high-level voltage applied to C turns on the

associated switch section.

•

Low On-State Resistance, Typically

≉

≉6 Ω

Applications

include

signal

gating,

chopping,

modulation or demodulation (modem), and signal

•

Latch-Up Performance Exceeds 100 mA Per

multiplexing for analog-to-digital and digital-to-analog

JESD 78, Class II

conversion systems.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2001–2014, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.