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ML22Q573 Datasheet(PDF) 67 Page - List of Unclassifed Manufacturers |
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ML22Q573 Datasheet(HTML) 67 Page - List of Unclassifed Manufacturers |
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67 / 69 page ![]() FEDL22Q553-02 ML22Q553 PACKAGE DIMENSIONS Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). Notes for heat sink type Package This LSI adopts a heat sink type package to raise a radiation of heat characteristic. Be sure to design the land pattern corresponding to the heat sink area of the LSI on a board, and solder each other. The heat sink area of the LSI solder open or GND on the board. 67/69 |
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