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HT817D0 Datasheet(PDF) 3 Page - Holtek Semiconductor Inc |
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HT817D0 Datasheet(HTML) 3 Page - Holtek Semiconductor Inc |
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3 / 15 page ![]() Pad Assignment Chip size: 2270 ´ 3630 (mm) 2 * The IC substrate should be connected to VSS in the PCB layout artwork. Pad Coordinates Unit: mm Pad No. X Y Pad No. X Y 1 -914.50 1612.75 11 912.80 1115.95 2 -914.50 1469.35 12 912.80 1254.55 3 -914.50 1278.75 13 912.80 1449.95 4 -987.90 -1638.25 14 912.80 1593.55 5 -254.60 -1611.75 15 709.50 1564.05 6 -18.90 -1611.75 16 179.20 1564.05 7 411.90 -1611.75 17 22.00 1564.05 8 674.70 -1611.75 18 -156.40 1564.05 9 806.10 -1642.35 19 -734.20 1564.05 10 937.90 -1611.75 HT817D0 3 March 15, 2000 1 11 2 12 3 13 4 14 5 15 6 16 7 17 8 18 9 19 10 (0 , 0 ) KE Y1 0 KE Y1 1 KE Y1 2 KE Y1 KE Y2 KE Y3 KE Y4 |
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