28F008B3 datasheet(3/49 Pages) INTEL

3 / 49 page

SMART 3 ADVANCED BOOT BLOCK–BYTE-WIDE

PRELIMINARY

CONTENTS

PAGE

1.0 INTRODUCTION .............................................5

1.1 Smart 3 Advanced Boot Block Flash

Memory Enhancements ..............................5

1.2 Product Overview.........................................6

2.0 PRODUCT DESCRIPTION..............................6

2.1 Package Pinouts ..........................................7

2.2 Block Organization .....................................11

2.2.1 Parameter Blocks ................................11

2.2.2 Main Blocks .........................................11

3.0 PRINCIPLES OF OPERATION .....................14

3.1 Bus Operation ............................................14

3.1.1 Read....................................................15

3.1.2 Output Disable.....................................15

3.1.3 Standby ...............................................15

3.1.4 Deep Power-Down/Reset ....................15

3.1.5 Write....................................................15

3.2 Modes of Operation....................................15

3.2.1 Read Array ..........................................16

3.2.2 Read Intelligent Identifier .....................17

3.2.3 Read Status Register ..........................17

3.2.4 Program Mode.....................................18

3.2.5 Erase Mode .........................................19

3.3 Block Locking.............................................26

3.3.1 VPP = VIL for Complete Protection .......26

3.3.2 WP# = VIL for Block Locking................26

3.3.3 WP# = VIH for Block Unlocking ............26

3.4 VPP Program and Erase Voltages ..............26

3.5 Power Consumption ...................................26

3.5.1 Active Power .......................................26

3.5.2 Automatic Power Savings (APS) .........27

3.5.3 Standby Power ....................................27

3.5.4 Deep Power-Down Mode.....................27

3.6 Power-Up/Down Operation.........................27

3.6.1 RP# Connected to System Reset ........27

3.6.2 VCC, VPP and RP# Transitions .............27

3.7 Power Supply Decoupling ..........................28

3.7.1 VPP Trace on Printed Circuit Boards ....28

4.0 ABSOLUTE MAXIMUM RATINGS ................29

5.0 OPERATING CONDITIONS

(VCCQ = 2.7V–3.6V).......................................29

5.1 DC Characteristics: VCCQ = 2.7V–3.6V.......30

6.0 OPERATING CONDITIONS

(VCCQ = 1.8V–2.2V).......................................34

6.1 DC Characteristics: VCCQ = 1.8V–2.2V.......34

7.0 AC CHARACTERISTICS...............................39

7.1 Reset Operations .......................................43

APPENDIX A: Ordering Information .................45

APPENDIX B: Write State Machine Current/

Next States ..................................................46

APPENDIX C: Access Time vs.

Capacitive Load...........................................47

APPENDIX D: Architecture Block Diagram ......48

APPENDIX E: Additional Information ...............49

28F008B3 Datasheet(PDF) 3 Page - Intel Corporation

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