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CD4536BMS Datasheet(PDF) 13 Page - Intersil Corporation |
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CD4536BMS Datasheet(HTML) 13 Page - Intersil Corporation |
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13 / 13 page ![]() 1248 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com CD4536BMS FUNCTIONAL TEST SEQUENCE INPUTS OUTPUTS COMMENTS IN 1 SET RESET 8-BYPASS DECODE OUT Q1 THRU 24 ALL 24 STEPS ARE IN RESET MODE 1011 0 1111 0 Counter is in three 8-stage section in parallel mode 0111 0 First “1” to “0” transition of clock 1 0 - - - 111 255 “1” to “0” transitions are clocked in the counter 0111 1 The 255 “1” to “0” transition 0000 1 Counter converted back to 24 stages in series mode. Set and Reset must be connected together and simultaneously go from “1” to “0” 1000 1 In1 Switches to a “1” 0000 0 Counter Ripples from an all “1” state to an all “0” state Test Function has been included for the reduction of test time required to exercise all 24 counter stages. This test function divides the counter into three 8-stage sections and 255 counts are loaded in each of the 8-stage sections in par- allel. All flip-flops are now at a “1”. The counter is now returned to the normal 24 steps in series configuration. One more pulse is entered into In1 which will cause the counter to ripple from an all “1” state to an all “0” state. Functional Test Sequence Chip Dimensions and Pad Layout Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch). METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches INTERSIL |
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