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OP220GS Datasheet(PDF) 4 Page - Analog Devices

Part # OP220GS
Description  Dual Micropower Operational Amplifier
PDF  12 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

OP220GS Datasheet(HTML) 4 Page - Analog Devices

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REV. A
–4–
OP220–SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±18 V
Differential Input Voltage . . . . . . . . . . 30 V or Supply Voltage
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage
Output Short-Circuit Duration
Indefinite
Storage Temperature Range . . . . . . . . . . . . –65
∞C to +150∞C
Junction Temperature (Ti) . . . . . . . . . . . . . –65
∞C to +150∞C
Operating Temperature Range
OP220A/OP220C . . . . . . . . . . . . . . . . . . –55
∞C to +125∞C
OP220E/OP220F . . . . . . . . . . . . . . . . . . . . –25
∞C to +85∞C
OP220G . . . . . . . . . . . . . . . . . . . . . . . . . . . –40
∞C to +85∞C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300
∞C
NOTES
*Absolute Maximum Ratings apply to packaged parts, unless otherwise noted.
WAFER TEST LIMITS
OP220N
Parameter
Symbol
Conditions
Limit
Unit
Input Offset Voltage
VOS
200
mV Max
Input Offset Voltage Match
VOS
300
mV Max
Input Offset Current
IOS
VCM = 0
2
nA Max
Input Bias Current
IB
VCM = 0
25
nA Max
Input Voltage Range
IVR
VS =
±15 V
–15/13.5
V Min
Common-Mode
CMRR
V– = 0 V, V+ = 5 V, 0 V
£ VCM £ 3.5 V
88
dB Min
Rejection Ratio
–15 V
£ VCM £ 13.5 V, VS = ±15 V
93
Power Supply
PSRR
VS =
±2.5 V to ±15 V
12.5
mV/V Max
Rejection Ratio
V– = 0 V, V+ = 5 V to 30 V
22.5
Large-Signal
AVO
RL = 25 k
W, VS = ±15 V
1000
V/mV Min
Voltage Gain
VO =
±10 V
Output Voltage Swing
VO
V+ = 5 V, V– = 0 V, RL = 10 k
W
0.7/4
V Min
VS =
±15 V, RL = 25 kW±14
Supply Current
ISY
VS =
±2.5 V, No Load
125
mA Max
(Both Amplifiers)
VS =
±15 V, No Load
190
NOTE
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packing is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on die lot qualification through sample lot assembly and testing.
(@ VS =
2.5 V, to
15 V, TA = 25 C, unless otherwise noted.)
Package Type
JA*
JC
Unit
8-Lead Hermetic DIP (Q)
148
16
∞C/W
8-Lead Plastic DIP (N)
103
43
∞C/W
8-Lead SOL (RN)
158
43
∞C/W
TO-99 (H)
150
18
∞C/W
* JA is specified for worst-case mounting conditions, i.e., JA is specified for device
in socket for CERDIP and PDIP packages; JA is specified for device soldered to
printed circuit board for SO packages.
DIE CHARACTERISTICS
DIE SIZE 0.097 INCH
0.063 INCH, 6111 SQ. MILS
(2.464 mm
1.600 mm, 3.94 SQ. mm)
NOTE : ALL V+ PADS ARE INTERNALL CONNECTED
1.
INVERTING INPUT (A)
2.
NONINVERTING INPUT (A)
3.
BALANCE (A)
4.
V–
5.
BALANCE (B)
6.
NONINVERTING INPUT (B)
7.
INVERTING INPUT (B)
8.
BALANCE (B)
9.
V+
10. OUT (B)
11. V+
12. OUT (A)
13. V+
14. BALANCE (A)
ORDERING GUIDE
TA = 25
∞C
Package Options
Operating
VOS MAX
Temperature
(mV)
CERDIP
Plastic
TO-99
Range
150
OP220AZ
*
MIL
150
OP220EZ
*
IND
300
OP220FZ
*
IND
750
OP220CJ
*
MIL
750
OP220GZ
* OP220GP*
XIND
750
OP220GS
XIND
For military processed devices, please refer to the Mil Standard
Data Sheet
OP220AJ/883
*.
*Not for new design. Obsolete April 2002.



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