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AN1009 Datasheet(PDF) 4 Page - STMicroelectronics |
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AN1009 Datasheet(HTML) 4 Page - STMicroelectronics |
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4 / 7 page ![]() Remedies AN1009 2 Remedies ST is continually making design and process modifications to improve the performance of its products. Immunity to negative undershoot will be improved over time, but only where it does not have a negative impact on other performance measures, such as operating speed. The application designer is, therefore, advised to take steps to avoid negative undershoot pulse from being introduced. The first step is to improve the cleanliness of each of the signals. Table 1: "List of the pins on devices that are affected by the problem"lists the pins of ST’s NVRAMS that are affected (those that consist of an N+ diffusion in a P-well on an N-type substrate). Table 1: List of the pins on devices that are affected by the problem Device Substrate type Pins connected to N+ diffusion M40Z111 N- 13, 16 M40Z300 N- 4, 10, 13, 16, 20, 22, 23 M48Z02, M48Z12 N- All M48Z08, M48Z18 P- None (not applicable) M48Z58, M48Z58Y N- 1, 11-13, 15-19, 26, 28 M48Z35, M48Z35Y N- All M48T02, M48T12 N- All M48T08, M48T18 P- (none) not applicable M48T58, M48T58Y, M48T59, M48T559 N- 1, 11-13, 15-19, 26, 28 M48T35, M48T35Y, M48T35AV N- All M48T37V, M48T37Y N- 1, 4-10, 13, 15-20, 22-26, 30, 31, 33-39 All pins that are connected to N+ diffusion are susceptible to negative undershoot, but special attention should be given to the VCC pin. This is connected to internal circuitry that increases the pin’s sensitivity to negative undershoots, to the extent that pulses of greater than -0.3 V may affect the substrate voltage. The second step, therefore, is to clamp the power lines (VCC and VSS) with a Schottky diode, to short out any attempt by them to go negative. Its effectiveness depends on its speed of operation set against the speed and energy content of the negative-going pulse (the current sink capability of the pulse). An off-the-shelf diode with a Vbe of approximately 0.32 V, and a current rating of 100 mA, will generally reduce the occurrence of the problem to negligible proportions. However, the higher the current sink capability of the negative pulse, the more likely an RF Schottky diode is required. The Schottky diode should be placed as close to the device pin as possible. VCC can be subject to mechanical noise, the switching of VCC on and off, and to negative spikes coming from the power supply during initial power up. The third step, then, is to clean up the power supply, particularly its behavior at power-on and power-off, where the memory device is expected to continue to power itself from its internal battery. Particular care should be taken when working with programmable power supplies. Forcing a 4/7 DocID006391 Rev 2 |
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