AN668 APPLICATION NOTE

18/19

Table 6. TDA7350A (Bridge Audio Amplifier)

6.

CONCLUSION

The PowerSO-20/36 packages, belonging to a new surface mount power package family, have been introduced

(Jedec MO-166 registered).

They have been designed specifically for the surface mount industry and they can replace Multiwatt in many

applications.

The main advantages of PowerSO-20/36 are:

1)

Good thermal characteristics. They are able to handle die with the same size as Multiwatt.

2)

Versatility. A wide variety of intelligent power products with a wide range of options can be managed.

3)

Symmetrical package design. Slug up and slug down versions can be delivered giving more opportunities

to the customers for power dissipation.

4)

High power density through reduced package volume and height.

5)

Compatibility with automatic placement equipment and soldering techniques used in surface-mount as-

sembly. Reliable and inspectable solder joints can be achieved.

6)

High reliability in terms of hermeticity. The correct choice of the materials and particular design features

allow the PowerSO-20/36 to pass successfully severe tests like pressure pot and die penetrant.

It was demonstrated that this package family well meets the high demands in surface-mount power applications,

where power ICs are becoming more and and more common.

Test

Condition

Sample

Duration

Failure

H.T.R.B.

77 pcs. x 3 lots

200hr

0

O.L.T.

90 pcs. x 3 lots

2000hr

0

T.H.B.

77 pcs. x 3 lots

2000hr

0

P.T.C.

33 pcs. x 3 lots

1000hr

0