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AN2639 Datasheet(PDF) 1 Page - STMicroelectronics |
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AN2639 Datasheet(HTML) 1 Page - STMicroelectronics |
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1 / 15 page ![]() July 2014 DocID14016 Rev 4 1/15 AN2639 Application note Soldering recommendations and package information for Lead-free ECOPACK microcontrollers Introduction STMicroelectronics microcontrollers support various types of Lead-free ECOPACK® package to meet customer requirements. The mounting technologies are Surface mount technology (SMT), and Through hole technology (THT). Beside the available mounting technology, the choice is often driven by technical and economical concerns. This application note describes the various package types used for microcontrollers, introduces the different mounting technologies, and gives soldering recommendations. www.st.com |
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