TN1176 datasheet(8/15 Pages) STMICROELECTRONICS

8 / 15 page

Peripheral migration

TN1176

8/15

DocID026267 Rev 1

Table 5. STM32L100x6/8/B-A and STM32L100x6/8/B device difference summary(1)

Function

STM32L100x6/8/B

STM32L100x6/8/B-A

Behavior / impact to software

Core @ 32MHz

ARM CortexTM-M3

Max DMIPS/MHz

1.25

Flash [KB]

up to 128

RAM [KB]

up to 10

up to 16

Enhancement: the application can

use larger RAM memory space.

EEPROM [KB]

Backup registers

[B]

Flash interface

[bits]

64/32

Bootloader

USART1/2

DMA / channels

1 / 7ch

USART

SPI / I2S

2 / 0

I2C

USB 2.0

1 x FS

LCD [seg x com]

8 x 28

LCD rails

decoupling

YES

Better LCD contrast for larger

displays (if used external LCD rails

decoupling capacitors). If not used no

software change is required.

TIMER

[32-bit/16-bit/Lite]

0/6/2

IWDG/WWDG

1/1

Clock

HSI/HSE/LSI/LSE

CSS on HSE

HSI/HSE/LSI/LSE

CSS on HSE/LSE

Extension of CSS to LSE. Backward

compatible. If not used then no

software change is needed.

HSI/HSI clock

trimming

Trimming by customer

(default +/- 10%)

Trimming by customer

(default +/- 10%)

RTC version

RTC V1.0

RTC V2.0

New RTC as in whole L1 family - with

subsecond resolution. If not used

then no software change is needed.

DAC

ADC (total / fast

channels)

1 (24 / 6)

Comparator

Touch sensing

[channels]

Temperature

sensor

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