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SP8256 Datasheet(PDF) 1 Page - SamHop Microelectronics Corp. |
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SP8256 Datasheet(HTML) 1 Page - SamHop Microelectronics Corp. |
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1 / 7 page ![]() Suface Mount Package. S mHop Microelectronics C orp. a SP8256 Symbol VDS VGS IDM 75 W A PD °C 1.67 -55 to 150 ID Units Parameter 20 11 90 °C/W V V ±12 TA=25°C Gate-Source Voltage Drain-Source Voltage THERMAL CHARACTERISTICS PRODUCT SUMMARY VDSS ID RDS(ON) (m Ω) Max 20V 11A 8.6 @ VGS=3.9V 8.3 @ VGS=4.5V FEATURES Super high dense cell design for low RDS(ON). Rugged and reliable. ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise noted) Limit Drain Current-Continuous c -Pulsed ac A Maximum Power Dissipation Operating Junction and Storage Temperature Range TJ, TSTG Thermal Resistance, Junction-to-Ambient R JA www.samhop.com.tw Dec,26,2014 1 Details are subject to change without notice. TA=25°C TA=70°C A TA=70°C W Dual N-Channel Enhancement Mode Field Effect Transistor Green Product ESD Protected. G2 S1 S1 G1 S2 S2 1 2 3 4 5 6 Bottom Drain Contact 8.8 1.07 10.0 @ VGS=3.1V 12.5 @ VGS=2.5V 9.0 @ VGS=3.5V D DF F N N 2 2X X 5 5 (Bottom view) G1 S1 S1 G2 S2 S2 D1/D2 Ver 1.3 5.5 °C/W Thermal Resistance, Junction-to-Case R JC |
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