IRF60DM206

 

2

www.irf.com

© 2015 International Rectifier

Submit Datasheet Feedback

June 04, 2015

Notes:



Mounted on minimum footprint full size board with metalized

back and with small clip heatsink.



Used double sided cooling , mounting pad with large heatsink.

Absolute Maximum Ratings

  

 

Symbol

Parameter

Max.

Units

130

82

A

Pulsed Drain Current 

530

 

Maximum Power Dissipation

96

W

Linear Derating Factor

0.78

W/°C

Gate-to-Source Voltage

± 20

V

Operating Junction and

-55 to + 150

°C

Storage Temperature Range

Avalanche Characteristics

  

Single Pulse Avalanche Energy 

81

Single Pulse Avalanche Energy 

154

Avalanche Current 

See Fig 15, 15, 23a, 23b

A

Repetitive Avalanche Energy 

mJ

Thermal Resistance

  

 

Symbol

Parameter

Typ.

Max.

Units

Junction-to-Ambient 

–––

45

Junction-to-Ambient 

12.5

–––

Junction-to-Ambient 

20

–––

°C/W

Junction-to-Case 

–––

1.3

Junction-to-PCB Mounted

0.75

–––

mJ

   

 

 

 

Symbol

Parameter

Min. Typ. Max. Units

Conditions

Drain-to-Source Breakdown Voltage

60

–––

–––

V

–––

38

Static Drain-to-Source On-Resistance

–––

2.2

2.9

m

–––

2.7

––– 

m

Gate Threshold Voltage

2.1

3.0 

3.7

V

Drain-to-Source Leakage Current

–––

–––

1.0

µA

–––

–––

150

Gate-to-Source Forward Leakage

–––

–––

100

nA

Gate-to-Source Reverse Leakage

–––

–––

-100

Internal Gate Resistance

–––

0.8

–––





TC measured with thermocouple mounted to top (Drain) of part.



Surface mounted on 1 in. square Cu

board (still air).



Mounted to a PCB with small clip

heatsink (still air)

 



Mounted on minimum footprint full size

board with metalized back and with

small clip heatsink (still air)