IRF7171MPBF datasheet(3/11 Pages) IRF

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IRF7171MTRPbF

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March 25, 2015

Absolute Maximum Ratings

Symbol

Parameter

Max.

Units

PD @TC = 25°C

Power Dissipation 

104

PD @TC = 100°C Power Dissipation 

PD @TA = 25°C

Power Dissipation 

2.8

Peak Soldering Temperature

270

Operating Junction and

-55 to + 150

°C

TSTG

Storage Temperature Range

Thermal Resistance

Symbol

Parameter

Typ.

Max.

Units

RJA

Junction-to-Ambient 

–––

RJA

Junction-to-Ambient 

12.5

–––

RJA

Junction-to-Ambient 

–––

°C/W

RJC

Junction-to-Can 

–––

1.2

RJA-PCB

Junction-to-PCB Mounted

1.0

–––

Notes:



Surface mounted on 1 in. square Cu board, steady state.



TC measured with thermocouple in contact with top (Drain) of part.



Used double sided cooling, mounting pad with large heat sink.



Mounted on minimum footprint full size board with metalized

back and with small clip heat sink.



R is measured at TJ of approximately 90°C.

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