2003 May 13

3

NXP Semiconductors

Product data sheet

PBSS5350Z

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

Notes

1.

2.

3.

For other mounting conditions see “Thermal considerations for SOT223 in the General Part of associated

Handbook”.

THERMAL CHARACTERISTICS

Notes

1.

Device mounted on a printed-circuit board; single sided copper; tinplated; mounting pad for collector 1 cm.

2.

3.

For other mounting conditions see “Thermal considerations for SOT223 in the General Part of associated

Handbook”.

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

collector-base voltage

open emitter

−

−60

V

collector-emitter voltage

open base

−

−50

V

emitter-base voltage

open collector

−

−6

V

collector current (DC)

−

−3

A

peak collector current

−

−5

A

peak base current

−

−1

A

total power dissipation

−

1.35

W

−

2

W

storage temperature

−65

+150

°C

junction temperature

−

150

°C

operating ambient temperature

−65

+150

°C

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to ambient

in free air; notes 1 and 3

92

K/W

in free air; notes 2 and 3

62.5

K/W